The microwave industry primarily uses a method called "thermocompression bonding" on gold wire.
Thermocompression bonding is used for bonding gold wire with heat, pressure and time. No ultrasonic energy is applied to the bond wire. This bonding process requires elevated temperatures during the bonding process when compared to "thermosonic bonding".
The heat is supplied by a heated workholder, which holds the part being bonded. The bonding wedge is usually heated as well. The bonding machine supplies the pressure as it pushes down the wedge onto the wire. The time or duration is how long the bonding wedge sits on the wire.